Pure tin hemisphere
Product diameters: 25mm, 19mm, 16mm, 13mm. Product features: Low impurity content, fine crystal lattice, uniform dissolution rate, which can achieve a uniform and dense coating on the plated parts, while reducing the generation of anode mud, improving electroplating efficiency, and effectively reducing electroplating costs. Product application: Electroplating of semiconductor components, electroplating of IC packaging, continuous plating of LED brackets and terminals, tin plating of circuit boards and hardware, etc. Product packaging: cardboard box packaging, with plastic bag inside, 20KG or 25KG/box.
Classification:
Product Description
Key words:
Related Products
Welcome your product consultation







